J9九游会AG

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铝基覆铜板 HA80

应用领(ling)域 / Application

照(zhao)明、背(bei)光(guang)源领(ling)域         Lighting and backlight fields

汽车(che)应用(yong)                 Automotive (Vehicle lightingregulatorconvertersPower module)

工业电子                 Industrial electronicsDC-DC converterPower suppliesSolid-State Relays transistor modules)

需要高(gao)散热的领域         The area needs high heat dissipation

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J9九游会AG产品 规格(ge)Specification

标(biao)准尺寸Standard Size

1000mm×1220mm1100mm×1220mm1050mm×1250mm

导电层Circuit Layer

(电解铜箔Copper foil

Hoz1oz2oz3oz

导热绝缘层厚度

Dielectric Layer Thickness

100μm125μm150μm

铝(lv)基板厚度(du) Thickness

0.6mm0.8mm1.0mm1.2mm1.5mm1.6mm2.0mm3.0mm

铝板类型(xing)及(ji)处理方法

Aluminum Substrate Type

10605052

阳极氧(yang)化法 Anodization

保护膜类型 Masking Film

PETPI

 如有(you)特殊(shu)要求,可定制any specific require could be available upon request

 

主要性能 Main property       

项目              Item

处(chu)理条件           Test condition

单位 Units

指标值Spec

  典型值 Typical Value

TypeA

Type1

Type2

Type3

Type4

0.8

1.0

1.5瓦(wa)

2.0

3.0

绝缘层热导率(lv) Insulating   layer   Thermal Conductivity

ASTM D 5470

W/ m·K

≥0.8

0.95





1.0±10%


1.1




1.5±10%



1.5



2.0±10%




2.0


3.0±10%





3.0

热阻 100um

Thermal resistance

ASTM D 5470

K·cm2/W

1.05

0.91

0.67

0.50

0.34

℃/W

0.163

0.141

0.104

0.078

0.052

剥离强度(du) 1OZ

Peel Strength

热应力前

N/mm

≥1.2

1.76

1.74

1.72

1.50

1.42

热应力后

1.65

1.65

1.63

1.40

1.39

热应力

Thermal   Stress

288℃,

solder dip

S

≥120

180S  No delamination

300*10s/cycle   solder dip

cycle

≥6

6No   delamination

表面(mian)电(dian)阻        Surface Resistivity

C96/35/90

≥104

107

107

107

107

107

E-24/125

≥103

105

105

105

105

105

体(ti)积电(dian)阻(zu)      Volume Resistivity

C96/35/90

MΩ·cm

≥106

108

108

108

108

108

E-24/125

≥103

105

105

105

105

105

击(ji)穿电压(ya)

Dielectric  Breakdown

IPC-TM-650 2.5.6.2

KV

≥3

100μm

4.0

4.0

4.0

4.0

3.5

≥4

150μm

6.0

6.0

6.0

6.0

5.5

耐电弧             Arc Resistance

IPC-TM-650 2.5.1

S

≥60

120

120

120

120

120

介电(dian)常数(1MHz)     

Dielectric   Constant

IPC-TM-650 2.5.5.2

5.4

5.4

5.7

6.0

6.8

燃(ran)烧性Flammability

E-24/125

V-0

V-0

V-0

V-0

V-0

V-0

玻璃化温(wen)度Tg

DSC

≥100

108

110

110

112

150

热分解温(wen)度Td

TGAWt5%loss

≥360

400

400

410

410

420

吸水率           Water Absorption

D-24/23

%

≤1.5

0.55

0.55

0.53

0.52

0.49

IPC-TM-650   2.6.2.1

CTI

IEC60112

V

≥600

 600

600

600

600

600