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H2600

特(te)性/ Features

无卤,Halogen-free

优(you)异的(de)耐漏(lou)电起痕性,CTI≥600 / Excellent tracking resistance ,CTI ≥600

优秀的(de)机(ji)械(xie)加工性,可(ke)冲孔加工,钻(zuan)(zuan)孔加工钻(zuan)(zuan)头使用寿命可(ke)延长

Excellent mechanical processability, punching process applicable, longer drill bit life .  

电性(xing)能与FR-4相当,加工工艺与FR-4相(xiang)同

Electrical properties and PCB processing similar to FR-4.

 

应用领域(yu)/ Applications 

电(dian)源基板、电(dian)视机、电(dian)冰箱、洗衣(yi)机等。

Power base boardTVrefrigeratorwashing machine and etc.

 

主要特性 / General properties

检测项目

Item               

单位

Unit

检测条件

Test   Condition

规范值

Spec

典型值

Typical   Value

玻(bo)璃化转变(bian)温(wen)度Tg

DSC

≥120

126.5

剥离强度 1oz Peel Strength

N/mm

260℃, 10S

≥1.05

1.50

热(re)应力Thermal stress

S

260℃,solder dip

10

60s                        

弯曲(qu)强度                                      Flexural Strength

N/mm2

经向 LW

≥250

380

纬向CW

≥150

310

燃烧性Flammability

E 24/125

UL94V-0

V-0

表面电阻

Surface   Resistivity

After moisture

≥1.0×104

2.27×106

体积电阻

Volume   Resistivity

MΩ·cm

After moisture

≥1.0×106

2.31×108

介电(dian)常数

Dielectric   Constant

1 MHZ

C 24/23/50

≤5.4

4.7

介质损耗(hao)角正切

Loss   Tangent

1 MHZ

C 24/23/50

≤0.035

0.016

耐电弧(hu)Arc Resistance

S

D48/50D0.5/23

≥60

120

击穿(chuan)电(dian)压

Dielectric    Breakdown 

KV

D48/50D0.5/23

≥40

55

吸水(shui)率Moisture   Absorption

%

D24/23

≤0.5

0.17

热分解温度Td

Weight Loss 5%

335

卤(lu)素(su)含量

Halogen content

Cl

ppm

 

EDX-GP

≤900

320

Br

ppm 

≤900

30

Cl+Br

ppm

≤1500

350

T288

min

TMA

1

相比漏电起痕指数 CTI                    

V

IEC-60112

≥600

600

Specimen Thickness : 1.6mm ;    Specification sheetIPC-4101D/12is for your reference only

Explanation: C: Humidity conditioning;         D: Immersion conditioning in distilled water ;

           E: Temperature conditioning ;