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高导热FR-4 HA10

应用领域/ Applications

适用于汽车电(dian)子设备,电(dian)源电(dian)路板(ban),多层铝基板(ban)等

Applications: Automotive electronic equipment, Power device , Multi-layers AL-substrate 

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主要(yao)特性 / General properties

检(jian)测(ce)项目

Item               

单位

Unit

检(jian)测条件

Test   Condition

规范值

Spec

典型值     Typical Value

热导率(lv)      

Thermal Conductivity

W/ m·K

ASTM D 5470

≥1.0

1.02

玻璃化转变温度Tg

DSC

≥110

120

剥离强度

1oz Peel Strength

N/mm

288℃, 10S

≥1.05

1.56

  热应(ying)力

Thermal stress

S

288℃,solder dip

10

120s                      No   delamination

弯曲强度                                     Flexural Strength

N/mm2

经向 LW

≥415

467

纬向CW

≥345

412

燃烧性Flammability

E 24/125

UL94V-0

V-0

表面电(dian)阻

Surface   Resistivity

After moisture

≥1.0×104

4.62×106

体(ti)积电阻

Volume   Resistivity

MΩ·cm

After moisture

≥1.0×106

3.76×107

耐电弧Arc Resistance

S

D48/50D0.5/23

≥60

128

击穿(chuan)电压

Breakdown Voltage

KV

IPC-TM-650  2.5.6.2

D48/50D0.5/23

≥40

60

吸(xi)水率

Moisture   Absorption

%

D24/23

≤0.5

0.35

CTI

V

IEC-60112

≥600

600

Specimen Thickness : 0.8mm ;  

Explanation: C: Humidity conditioning;D:Immersion conditioning in distilled water ; E:Temperature conditioning ;